Dash number W66BP6NBHAGJ
Product category Memory
Manufacturer Winbond Electronics Corporation
Type 2GB LPDDR4, X16
Encapsulation -
Packing Tray
Quantity 1
RoHS status

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Dash number
W66BP6NBHAGJ
Product category
Memory
Manufacturer
Winbond Electronics Corporation
Type
2GB LPDDR4, X16
Encapsulation
-
Packing
Tray
Quantity
0
RoHS status
Similar models
W66BP6NBHAGJ
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低功耗雙存取同步动态随机存取内存-第四代(4/4X)
W66BP6NBHAGJ
华邦-Winbond
低功耗雙存取同步动态随机存取内存-第四代(4/4X)
Product parameters
Product Description
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case100-VFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency1.867 GHz
Memory FormatDRAM
Supplier Device Package100-VFBGA (10x7.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization128M x 16

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Service hours: Monday to Saturday 9:00-18:00
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